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Electromagnetics Field Simulation with ANSYS Maxwell ...
During this webinar you will be updated on the latest capabilities of ANSYS Maxwell for low-frequency electromagnetic field simulation for a variety of applications. The newest functionality in ANSYS Maxwell as well as the supporting circuit-simulation and co-simulation methodologies will also be presented.

Author: ANSYS, Inc.
Type: Webinar
Product Name: ANSYS Maxwell
Product Category: Electronics
Industry: High Tech

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Improve your Chip Reliability using Thermal EM and ESD ...
Full-chip reliability is critical for achieving successful silicon. This requires analysis that considers the impact of noise coupling, ESD and thermal effects from early in the design cycle to sign-off. FinFETs offer higher performance at the same power budget, or equal performance at a lower power budget, when compared to other chip designs. But lower noise margins and higher current density lead to thermal effects, including self-heat in FinFET transistors. Attend this webinar to learn how ANSYS solutions can help you ensure chip-level reliability on the latest FinFET-based designs. Discover how ANSYS simulations can solve reliability issues, including noise coupling with on-chip mixed-signal, electromigration (EM), ESD, local self-heating and the overall thermal impact on noise and EM.

Author: ANSYS
Type: Webinar
Industry: High Tech

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Simulation des interférences en radio-fréquences dans des ...
Les interférences en radio-fréquences (RFI) dans des environnements complexes sont une problématique omniprésente dans le monde actuel, c’est la conséquence directe de la prolifération des équipements sans fil. Des grandes installations RF sur les véhicules et les bâtiments aux installations sans fil de bureau en passant par les appareils électroniques que nous portons dans nos poches, de multiples systèmes RF intégrés doivent coexister pacifiquement dans leurs environnements d'exploitation. La compatibilité RF doit être prise en compte dès le début de la conception du système afin d'assurer un fonctionnement sans interférences dans son environnement d’utilisation.
Ce webinar montre comment la simulation peut être utilisée pour prédire les problèmes potentiels de RFI dans des environnements complexes grâce aux outils ANSYS EMIT et ANSYS HFSS.

Author: ANSYS
Type: Webinar
Product Name: ANSYS HFSS
Product Category: Electronics
Industry: High Tech

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Electromagnetic Simulation of Embedded Antennas in PCBs ...
Demands for reductions of size and cost of wireless electronic modules requires smart engineering approaches as this implies a strong coupling between the antenna and the adjacent electronic circuit. These challenges can be addressed by advanced simulation environment like the ANSYS ELECTRONIC Desktop which allows a tight coupling between the electromagnetic model and the circuit elements. This Webinar includes relevant aspects like the design flow (import and assembly of various CAD data), usage of advanced solver technology and combination with electronic circuit elements. With this approach the radiation performance can be characterized as well as the electromagnetic interference between circuit and antenna.

Author: ANSYS
Type: Webinar
Product Name: ANSYS HFSS
Product Category: Electronics
Industry: High Tech

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Ten New Advancements in High Tech Simulation with ANSYS ...
Engineering simulation has played a large role in making possible many of the electronic conveniences we take for granted — communication through Internet-enabled phones, electronic payments, and digital streaming, to name just a few. By helping engineers to understand the physics behind the electronics, ANSYS simulation solutions have enabled continuous engineering improvements to be delivered through cheaper, faster, more precise electronics. Attend this webinar to learn about the advances in our latest release, ANSYS 17.0, which will help you improve product reliability and performance, while reducing design cost and time. Discover how ANSYS electronics and semiconductor simulation solutions can simplify and accelerate your development of secure IP, wireless system and Chip-Package-System designs, along with many other electronic devices.

Author: ANSYS
Type: Webinar
Product Category: Electronics
Industry: High Tech
Sub-Industry: Semiconductor Design

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10x schneller zur Analyse mit ANSYS Space Claim
ANSYS 17.0 bringt umfangreiche Verbesserungen im ANSYS SpaceClaim Direct Modeler. Im neuen Release werden neben der Geschwindigkeit für das Design auch die Konzeption, die Bearbeitung und die Vorbereitung von Geometrie für die Simulation deutlich verbessert. Neue Funktionen wurden hinzugefügt, einschließlich Skripting und Werkzeuge zur Reparatur von Kanten oder Linien und zum Erstellen von Schweißnähten in Shell-Modellen (Oberflächenmodellen). Vorhandene Analysewerkzeuge, wie beispielsweise das Aufteilen von Flächen (Imprinting), Erstellen von Mittelflächen (Midsurfacing) und Unterstützung von Balkenelementen (Beam support) wurden ebenfalls verbessert. Lernen Sie zwei weitere wichtige neue Funktionalitäten im SpaceClaim Direct Modeler kennen: „Skin Surface“ und „Skrinkwrap“. Mit der Funktion „Skin Surface“ werden weitere Möglichkeiten in der Flächen- und Geometrierückführung von eingescannten Geometrien bereitgestellt. Es ermöglicht einen einfachen Weg STL Scan-Daten in Geometrie zu überführen. „Skrinkwrap“ glättet und bereinigt grobe Scan-Daten oder schlechte CAD-Geometrien. Zusammen mit „Skin Surface“ wird Ihr facettiertes Modell schneller in Geometrie zurückgeführt.

Author: ANSYS
Type: Webinar
Industry: Aerospace & Defense

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Advanced Methods to Design of Electric Machines - Webinar
Engineers who design electric machines need simulation tools that can be employed for quick, accurate product development. By employing finite element methods early in the design process, they can accelerate development and achieve higher machine efficiencies using less material, which reduces costs. View this webinar to explore the analysis and optimal design of electric machines, with emphasis on advanced material properties (demagnetization, vector hysteresis, etc.). Learn about techniques to extract a motor model for hardware-in-the-loop tools and for power electronics.

Author: ANSYS
Type: Webinar
Industry: High Tech

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Designing Products for M2M, the Internet of Things and the ...
The world is becoming increasingly digital, driven by near ubiquitous connectivity, inexpensive processing and sensor solutions, and the ability to use the Internet to facilitate and expand communication between electronic devices and systems. This webinar will feature an IoT and M2M expert from IHS and ANSYS Chief Product Officer Walid AbuHadba who will share the latest information on designing products that make the IoT a reality. Attendees will also gain insight into design automation and simulation technologies that can help create more reliable, smart and connected products.

Author: Marc Horner, ANSYS, Inc.
Type: Webinar
Industry: High Tech

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CFD simulation for CAD users with ANSYS Workbench ...
Used and trusted by engineering companies all over the world, the Computational Fluid Dynamics (CFD) simulation tools from ANSYS are used daily to solve real problems with ease. ANSYS Workbench brings flow and heat transfer analysis to designers and engineers in a productive and easy to use environment. The ANSYS CFD tools provide fit-for-purpose simulation capabilities for those requiring reliable and accurate CFD results to support their product development processes when pretty pictures aren't enough During this webinar you will be introduced to the capabilities of ANSYS Workbench for CFD simulation working in tandem with your preferred Mechanical CAD software

Author: ANSYS, Inc.
Type: Webinar
Product Name: ANSYS CFX
Product Category: Fluid Dynamics
Industry: Aerospace & Defense

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Structural Mechanics FEA simulation for CAD users with ...
Used and trusted by engineering companies all over the world, the structural mechanics FEA simulation tools from ANSYS are used daily to solve real problems with ease. ANSYS Workbench brings stress and thermal FEA capabilities to designers and engineers in a productive and easy to use environment, for simulations ranging from single-parts to complex assemblies. The ANSYS FEA tools provide fit-for-purpose simulation capabilities for the designer starting to use FEA for the first time through to those with more sophisticated requirements beyond the reach of CAD-embedded FEA. During this webinar you will be introduced to the capabilities of ANSYS Workbench for structural mechanics FEA simulation working in tandem with your prefered CAD software

Author: ANSYS, Inc.
Type: Webinar
Product Name: ANSYS DesignSpace
Product Category: Structural Mechanics
Industry: Aerospace & Defense

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